Location

Room 1116, Marcus

Title:  Dense Interconnect and Power Delivery Technologies for 3D Heterogeneous Integration Architectures

Committee:

Dr. Muhannad Bakir, ECE Chair, Advisor

Dr. Shimeng Yu, ECE

Dr. Azadeh Ansari, ECE

Dr. Visvesh Sathe,ECE

Dr. Andrew Kummel, UCSD