"Microengineering Technology for Enhancing Realism of Organs on Chip Models"

Yoshikazu Hirai, Ph.D.
Junior Associate Professor
Department of Mechanical Engineering and Science
Kyoto University, Japan

HYBRID Event
In-person location - RSVP HERE by Oct. 25:
Krone Engineered Biosystems Building (EBB)
905 Atlantic Drive, CHOA Seminar Room
Atlanta, GA 30332
*lunch served @ 12:50 p.m.

To attend virtually, RSVP here for link.

ABSTRACT
Though micro-physiological systems have advanced rapidly in a short time span, the field remains a hotbed of innovation. Our aiming to enhance modeling for complex systems with micro engineering technology have created integrated multi-organ chips (Body-on-a-chips) that is better for studying diseases and discovering drugs. In this presentation, I will introduce Body-on-a-chip microdevices fabricated using three-dimensional microfabrication techniques and integration of transepithelial electrical resistance (TEER) measurement techniques onto the chip.

BIO
Yoshikazu Hirai received received the B.S. and M.S. degrees from Ritsumeikan University, Japan, in 2002 and 2004, respectively, and the Ph.D. degree from Kyoto University, Japan, in 2007, all in mechanical engineering.

He was a Postdoctoral Researcher with the Graduate School of Engineering, Kyoto University. In 2009, he joined the Advanced Biomedical Engineering Research Unit, Kyoto University. Since 2013, he has been an Assistant Professor with the Department of Micro Engineering, Kyoto University. He was an Adjunct Assistant Professor with the Institute for Integrated Cell-Material Sciences, Kyoto University, from 2014 to 2017.

His current research interests include (1) Fabrication and Packaging for Generic MEMS/NEMS, (2) Optical lithography for 3-Dimensional microstructuring, (3) Atomic MEMS device (e.g., CSAC: Chip Scale Atomic Clock, CSAM: Chip Scale Atomic Magnetometer), (4) Microfluidics, and (5) Bio-Microsystems for in vitro measurement (e.g., Organ/Body on a Chip). He is a Member of the IEEE, MRS, the Institute of Electrical Engineers of Japan (IEEJ), the Japan Society of Mechanical Engineers (JSME), the Society for Chemistry and Micro-Nano Systems (CHEMINAS), and Japan Institute of Electronics Packaging (JIEP).